Description
High thermal conductivity
Ultra-thin film with excellent insulation
Good mechanical & chemical stability
Very easy for die-cutting and insulation
Low cost solution for many application
Application：
Used for attaching heatsinks to CPU GPU, high power LED,
Video Card RAM, DDR Memory Modules and other power Semiconductors.
Key Properties：
Thickness: 0.2mm
Width: 5mm~30mm (your option)
Length: 25M/roll
Adhesive power: 1.3kg/inch
Thermal conductivity: 1.5W/m.K
Breakdown Voltage: 4KV
Long term heat resistance: 120℃ Celsius
Short term heat resistance: 180℃ Celsius
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